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How Does Our Patented Boron CLS Bond® Technology Work?
• Boric acid is introduced to a metallic substrate in the presence of water vapor. Interaction between the substrate, the water (H2O), and Boric Acid (H3BO3) forms a continuously self-replenishing film of boric oxide (B2O3) that bonds to the substrate, forming a corrosion-resistant barrier.
• The boric oxide spontaneously reacts with the air, replenishing the Boric Acid . The Boric Acid molecules form into crystal platelets, each of which is a triclinic lattice of molecules strongly bound together by macromolecular covalent bonds (see microscopic photo above).
• Aligned by the mechanical motion of the substrate, the platelets form stacked layers with very small (0.318 nm) spaces between. As a result, the inter-platelet layers are bound by weak "van der Waals" forces, allowing a very low coefficient of friction.