My career was for the most part in SEMI. A critical document was the customer supplied spec, or Tool Description document. There was no form; the customer requirements were free form. One fab might include things that others did not.
It is also important to understand that the chips in a Honda, or whatever, require less capability than say an Apple cell phone chip. The TSMC foundry will not make car chips. Last I knew, Japan's Renesas was big in automotive chip making.
TSMC has automotive customers. Some of their processes are dedicated for automotive chips.
https://automotive.tsmc.com/english/dedicatedFoundry/technology/automotive.htm
I thought the big players were Maxim and NXP. They're mostly looking for mixed-signal, and they generally don't need or want to pay for the most advanced process nodes.
My career has often been about redesigning for a different process as older ones got phased out. Of course we might also add features or take advantage of better performance, but the heart of the design stayed the same. There was a lot of work just making sure everything was squared away migrating to a different process and fab.